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Innovation and quality are values that ATXWH prides itself for delivering leading-edge technologies and solutions to customers, meeting their demanding requirements such as electrical performance, heat dissipation, cost and aggressive cycle time. ATXWH continues to invest the maximum in research and development through its high caliber engineering teams and advanced manufacturing processes.
The advanced manufacturing process technologies that we provide include third generation semiconductor (SiC & GaN) product, heat sink with ceramic product. We also offer standard products such as TO/DFN/SO product. Our broad product portfolio provides customers the flexibility to select package types that best suit the needs of their chip designs.
ATXWH has also developed lead-free solutions to eliminate lead in electronic interconnections from both the legislative and competitive sides. J-alloy solder & Ag sintering epoxy are used in mass production to generate alternative semiconductor package applications that grant our customers environmentally-friendly packages without compromising the reliability.
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